MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials used in the production of printed circuit boards. The company offers various chemicals for electronic substrates, such as roughening type adhesion enhancement; rolled annealed copper roughening treatment; pre-lamination treatment of multilayer substrates and adhesion enhancement for high-frequency substrates; anisotropic etching and seed layer etching; copper surface treatment for CO2 laser direct drilling; degreasing, rust removal, temporary anti-tarnish; other metal surface treatment; DFR pre-treatment; microetching; and various residue removal treatment. It also provides AMALPHA, a metal surface treatment technology for direct metal and resin bonding. The company was incorporated in 1969 and is headquartered in Amagasaki, Japan.