STMicroelectronics details company-wide program to reshape manufacturing footprint and resize global cost base
PR No: C3330C STMicroelectronics details company-wide program to reshape manufacturing footprint and resize global cost base Increasing efficiency, automation, and AI will strengthen ST’s key technology R&D, design and high-volume assets for advanced manufacturing in Europe.Planned investments over FY2025, 2026 and 2027 to focus on advanced manufacturing infrastructure in 300mm silicon, 200mm silicon carbide, and technology R&D, for the benefit of customers globally.Company-wide program, includi