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Resonac Holdings Corporation (SHWDY)

20.10

0.00

(0.00%)

At close: May 19 at 4:00:00 PM EDT

Resonac Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor Packages

TOKYO, September 19, 2024--Resonac has developed a temporary bonding film to support a wafer on a glass carrier in the semiconductor device fabrication and packaging.

Business Wire 7 months ago

SHWDF

SHWDY
0.00%

Performance Overview

Return	SHWDY	Nikkei 225 (^N225)
YTD	-22.60%	-5.93%
1-Year	-14.86%	-3.94%
3-Year	+8.96%	+40.35%