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Resonac Holdings Corporation (SHWDY)

22.65

0.00

(0.00%)

At close: March 14 at 4:00:00 PM EDT

Resonac Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor Packages

TOKYO, September 19, 2024--Resonac has developed a temporary bonding film to support a wafer on a glass carrier in the semiconductor device fabrication and packaging.

Business Wire 5 months ago

SHWDF

SHWDY
0.00%

Performance Overview

Return	SHWDY	Nikkei 225
YTD	-14.20%	-7.12%
1-Year	+10.17%	-4.52%
3-Year	+20.78%	+46.41%