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Resonac Holdings Corporation (SHWDF)

23.15

-3.16

(-12.01%)

At close: April 4 at 4:00:00 PM EDT

Resonac Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor Packages

TOKYO, September 19, 2024--Resonac has developed a temporary bonding film to support a wafer on a glass carrier in the semiconductor device fabrication and packaging.

Business Wire 6 months ago

SHWDF
-12.01%
SHWDY
-34.56%

Performance Overview

Return	SHWDF	Nikkei 225 (^N225)
YTD	-12.01%	-21.95%
1-Year	+2.71%	-20.15%
3-Year	+0.63%	+15.80%