Shin-Etsu Chemical: Developing Equipment to Manufacture Semiconductor Package Substrates for the Back End Process and Pursuing a New Manufacturing Method
TOKYO, June 12, 2024--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, "Shin-Etsu Chemical") has developed equipment to manufacture semiconductor package substrates with a new manufacturing method subsequently to manufacturing micro-LED manufacturing system. The equipment is a high-performance processing equipment using excimer laser in which a dual damascene method, as is also used in the front end of semiconductor manufacturing process, i