Frankfurt - Delayed Quote EUR

HEICO Corporation (HC1.F)

266.30
+3.10
+(1.18%)
As of 4:14:46 PM GMT+2. Market Open.
Loading Chart for HC1.F
  • Previous Close 263.20
  • Open 266.30
  • Bid 260.70 x 20000
  • Ask 262.30 x 20000
  • Day's Range 263.20 - 266.90
  • 52 Week Range 196.95 - 275.90
  • Volume 108
  • Avg. Volume 33
  • Market Cap (intraday) 32.834B
  • Beta (5Y Monthly) 1.05
  • PE Ratio (TTM) 69.71
  • EPS (TTM) 3.82
  • Earnings Date Aug 25, 2025 - Aug 29, 2025
  • Forward Dividend & Yield 0.21 (0.08%)
  • Ex-Dividend Date Jan 3, 2025
  • 1y Target Est --

HEICO Corporation, through its subsidiaries, designs, manufactures, and sells aerospace, defense, and electronic related products and services in the United States and internationally. It operates in two segments Flight Support Group (FSG) and Electronic Technologies Group (ETG). The FSG segment provides jet engine and aircraft component replacement parts; thermal insulation blankets and parts; renewable/reusable insulation systems; and specialty components and assemblies. This segment also distributes hydraulic, pneumatic, structural, interconnect, mechanical, and electro-mechanical components for the commercial, regional, and general aviation markets; and offers repair and overhaul services for jet engine and aircraft component parts, avionics, instruments, composites, and flight surfaces of commercial aircraft, as well as for avionics and navigation systems, subcomponents, and other instruments utilized on military aircraft. The ETG segment provides electro-optical infrared simulation and test equipment; electro-optical laser products; electro-optical, microwave, and other power equipment; electromagnetic and radio frequency (RF) interference shielding and suppression filters; power electronics; power conversion and interface products; interconnection devices; and underwater locator and emergency locator transmission beacons. This segment also offers traveling wave tube amplifiers and microwave power modules; memory products and specialty semiconductors; harsh environment connectivity products and custom molded cable assemblies; RF and microwave products; communications and electronic intercept receivers and tuners; self-sealing auxiliary fuel systems; active antenna systems and airborne antennas; nuclear radiation detectors; silicone products; power amplifiers; ceramic-to-metal feedthroughs and connectors; technical surveillance countermeasures equipment; RF receivers and sources; embedded computing solutions; test sockets and adapters; radiation assurance services; and electronic components and rotary joint assemblies. The company was incorporated in 1957 and is headquartered in Hollywood, Florida.

www.heico.com

10,000

Full Time Employees

October 31

Fiscal Year Ends

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Performance Overview: HC1.F

Trailing total returns as of 5/30/2025, which may include dividends or other distributions. Benchmark is S&P 500 (^GSPC) .

YTD Return

HC1.F
14.64%
S&P 500 (^GSPC)
0.49%

1-Year Return

HC1.F
36.56%
S&P 500 (^GSPC)
11.80%

3-Year Return

HC1.F
99.46%
S&P 500 (^GSPC)
40.76%

5-Year Return

HC1.F
191.99%
S&P 500 (^GSPC)
92.26%

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Statistics: HC1.F

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Valuation Measures

Annual
As of 5/29/2025
  • Market Cap

    32.45B

  • Enterprise Value

    34.26B

  • Trailing P/E

    69.08

  • Forward P/E

    69.44

  • PEG Ratio (5yr expected)

    4.21

  • Price/Sales (ttm)

    10.05

  • Price/Book (mrq)

    10.19

  • Enterprise Value/Revenue

    9.31

  • Enterprise Value/EBITDA

    35.08

Financial Highlights

Profitability and Income Statement

  • Profit Margin

    14.54%

  • Return on Assets (ttm)

    7.34%

  • Return on Equity (ttm)

    15.71%

  • Revenue (ttm)

    4.13B

  • Net Income Avi to Common (ttm)

    601.01M

  • Diluted EPS (ttm)

    3.82

Balance Sheet and Cash Flow

  • Total Cash (mrq)

    242.31M

  • Total Debt/Equity (mrq)

    50.95%

  • Levered Free Cash Flow (ttm)

    467.29M

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