BE Semiconductor Industries N.V. (BSI.DE)
Key Executives
| Name | Title | Pay | Exercised | Year Born |
|---|---|---|---|---|
| Mr. Richard W. Blickman | Chairman of Management Board, President & CEO | 4.47M | -- | 1954 |
| Andrea Kopp-Battaglia | Senior Vice President of Finance | -- | -- | 1978 |
| Mr. Henk-Jan Jonge Poerink | Senior Vice President of Global Operations | -- | -- | 1970 |
| Mr. Chris Scanlan | Senior Vice President of Technology | -- | -- | 1969 |
| Mr. Edmond Franco | Vice President of Corporate Development | -- | -- | -- |
| Mr. Rene W. Hendriks | Senior Vice President of Sales - North America & Europe | -- | -- | 1961 |
| Mr. Peter Wiedner | Senior Vice President of Sub Micron Die Attach | -- | -- | 1970 |
| Mr. Jong Kwon Park | Senior Vice President of Sales & Customer Support - APAC | -- | -- | 1966 |
| Mr. Jeroen Kleijburg | Senior Vice President of Packaging | -- | -- | 1974 |
| Mr. Christoph Scheiring | Senior Vice President of Die Attach | -- | -- | 1970 |
BE Semiconductor Industries N.V.
- Sector:
- Technology
- Industry: Semiconductor Equipment & Materials
- Full Time Employees:
- 1,812
Description
BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries in the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company offers die attach equipment, such as single chip, multi-chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, thermos compression and embedded bridge die bonding, die lid attach, and fan out wafer level packaging; packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment comprising tin, copper, precious metal and solar plating systems, and related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's brand names include Datacon, Esec, Fico, and Meco. It serves multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.
Corporate Governance
Upcoming Events
April 23, 2025 at 5:00 AM UTC
BE Semiconductor Industries N.V. Earnings Date
April 25, 2025 at 12:00 AM UTC
Ex-Dividend Date
Recent Events
Recent Events Information Not Available