ChipMOS TECHNOLOGIES INC. research, develops, manufactures, and sells high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, Japan, People's Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, LCDD, Bumping and others. It offers a range of back-end testing services for high density memory, mixed-signal and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, mixed signal and Display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips still in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.