Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
LONDON & TORONTO, December 20, 2024--Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, proudly introduces the industry’s first 64 Gbps Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D) IP Subsystem to deliver unprecedented chiplet interconnect data rates, setting a new standard for ultra-high-performance D2D connectivity solutions in the industry. The third generation, 64 Gbps IP Subsystem builds on