- Previous Close
28.26 - Open
28.17 - Bid 29.58 x --
- Ask 29.58 x --
- Day's Range
27.91 - 30.23 - 52 Week Range
13.73 - 58.20 - Volume
9,975,030 - Avg. Volume
10,398,095 - Market Cap (intraday)
4.685B - Beta (5Y Monthly) -0.24
- PE Ratio (TTM)
184.81 - EPS (TTM)
0.16 - Earnings Date --
- Forward Dividend & Yield --
- Ex-Dividend Date Jun 23, 2005
- 1y Target Est
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WenYi Trinity Technology Co., Ltd researches and develops molds and equipment technology for the semiconductor and chemical building materials industries in China and internationally. The company provides semiconductor integrated circuits packaging molds and equipment, plastic profile extrusion molds and equipment, belt conveyor idler bearing housings, seals, etc. The company was formerly knowns as Tongling Zhongfa Sanjia Technology Co., Ltd. and changed its name to WenYi Trinity Technology Co., Ltd in 2011. WenYi Trinity Technology Co., Ltd was founded in 2000 and is based in Tongling, China.
www.chinatrinity.comRecent News: 600520.SS
View MorePerformance Overview: 600520.SS
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1-Year Return
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Statistics: 600520.SS
View MoreValuation Measures
Market Cap
4.68B
Enterprise Value
4.55B
Trailing P/E
184.81
Forward P/E
--
PEG Ratio (5yr expected)
--
Price/Sales (ttm)
15.49
Price/Book (mrq)
12.51
Enterprise Value/Revenue
14.84
Enterprise Value/EBITDA
151.94
Financial Highlights
Profitability and Income Statement
Profit Margin
8.55%
Return on Assets (ttm)
1.88%
Return on Equity (ttm)
7.29%
Revenue (ttm)
306.75M
Net Income Avi to Common (ttm)
26.23M
Diluted EPS (ttm)
0.16
Balance Sheet and Cash Flow
Total Cash (mrq)
173.63M
Total Debt/Equity (mrq)
11.23%
Levered Free Cash Flow (ttm)
12.18M