Greatek Electronics Inc., together with its subsidiaries, engages in the packaging and testing of various integrated circuits (IC) in Taiwan, Asia, America, Europe, and Africa. The company offers packaging products, such as traditional lead frame, quad flat no-lead, bumping, stack die and side by side, ball grid array, land grid array, redistribution layer, wafer level chip scale, flip chip, IC molded interconnected substrate, and system in a package. It offers wafer and final testing services, including testing program development, platform conversion, devices correlation, engineering, test peripheral equipment, and spare parts development service for logic, mix mode, and analog devices; IC semiconductor package assembly services; and package design services for electrical and thermal characterization. In addition, the company provides leadframe based packages, including P-DIP, transistor outline/small outline transistor/thin small outline transistor packages, small-outline packages (SOP), mini-SOP, shrink SOP, thin shrink SOP, small outline J-leaded and plastic leaded chip carrier packages, quad flat package (QFP), low profile QFP, and thin QFP. Further, it provides metal plating on semiconductor lead frames. The company was formerly known as He Teh Integrated Circuit Co. Ltd. in October 1995. Greatek Electronics Inc. was founded in 1972 and is headquartered in Miaoli, Taiwan.