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Valens Semiconductor to Showcase High-Performance Connectivity Innovations for AI Applications at Embedded World 2025

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HOD HASHARON, Israel, March 10, 2025 /PRNewswire/ -- Valens Semiconductor (NYSE: VLN), a leader in high-performance connectivity, today announced that it will display its innovative connectivity technology required for various AI applications at Embedded World 2025. Valens will display demonstrations in collaboration with a variety of companies, all offering the machine vision market cutting-edge solutions based on Valens' standard-compliant chipsets. These companies include Leopard Imaging, Acroname, Airy3D, Cherry Embedded Solutions, D3 Embedded, Fabrimex, Framos, Intel, RGo Robotics, and Teledyne e2v.

Valens Semiconductor Logo
Valens Semiconductor Logo

Two innovative connectivity standards, MIPI A-PHY and HDBaseT USB3, will take center stage at the Valens booth. MIPI A-PHY provides native extension of the widely-used CSI-2 interface, offering robotics developers the ability to separate processing from the perception sensors, which provides unprecedented design flexibility, cost-efficiency, and performance. HDBaseT USB3 provides the extension of USB 3.2, allowing leading camera vendors to extend their USB 3.2 product lines for applications requiring long link distances.

Demonstrations at Valens' booth will include:

The Ultimate Connectivity Infrastructure for NVIDIA – AI platforms, including AMR, robotic arms, and more.

EMC Technology Shootout – Valens chipsets withstand 20 times more noise in a live side-by-side EMC shootout against a competing legacy solution.

Simplest Wiring Infrastructure – Native CSI-2 extension based on the MIPI A-PHY standard, enabling high-speed, long-reach sensor connectivity over the most challenging connectors and cables.

Solving USB Challenges for Embedded Systems – Extension and test automation for the USB 3 protocol.

Valens will have two speaking opportunities at the show:

  • How Can Connectivity Innovations Transform the Industrial Market?

    • March 11, 11:00-11:30AM CET

    • Session 1.1 IOT & Connectivity

  • Addressing the Challenges in the Medical Industry's Transition to Disposable Endoscopes

    • March 11, 3:00 – 3:30PM CET

    • Session 6.1 Embedded Vision

"Valens' entry into machine vision is already shaking up the market, with two standard-compliant chipsets that offer transformative connectivity," said Moti Strobach, VP Business Development at Valens Semiconductor. "Our chipsets extend two of the most commonly used interfaces in the industry, allowing our customers and partners to reach new and exciting applications. We're proud to showcase our technology at Embedded 2025, and we welcome you to visit us at our booth."