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Investing.com -- Taiwan Semiconductor Manufacturing Co is laying the foundation for a $1 trillion global semiconductor industry by 2030 through relentless innovation across advanced logic, packaging, and manufacturing, Bank of America said.
BofA reiterated its “Buy” rating and NT$1,250 price objective on TSMC, saying the firm’s leadership in artificial intelligence, high-performance computing, and emerging fields such as humanoid robotics and 6G makes it a central enabler of future chip growth.
“AI is still in its early stages,” BofA wrote, adding that TSMC’s consistent roadmap and expanding technology stack, from data centers to edge AI, positions it to support semiconductor demand that could double to over $1 trillion globally by 2030.
TSMC unveiled its A14 node targeting 2028 production, offering up to 30% power reduction and 15% performance gain over 2nm technology.
A14 will use second-generation GAA transistors and a new NanoFlex Pro cell architecture, with a follow-on version featuring backside power delivery expected in 2029.
The company is also advancing its packaging capabilities, including CoWoS scaling to 9.5x reticle size and SoW-X, a platform enabling over 40x compute power versus current CoWoS. Mass production is set for 2027.
TSMC’s strength in manufacturing was reinforced by rapid scaling in CoWoS and SoIC capacity, both growing at over 80% CAGR through 2026, while its silicon photonics strategy promises major efficiency gains in next-gen AI systems.
BofA estimates TSMC’s silicon solutions generated $250 billion in value for U.S. firms in 2024, with that figure expected to double by the end of the decade.
“TSMC reaffirmed that Al datacenter momentum remains strong into 2025, boosting leading edge nodes and advanced packaging,” analysts at BofA said.
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