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Sivers Semiconductors receives CHIPS Act funding award from NEMC Hub to Advance FR3 Beamformer ICs and Array Design for 5G/6G

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$6M award accelerates lab-to-fab development of critical chip technology

BOSTON, Sept. 30, 2024 /PRNewswire/ -- Today, Sivers Semiconductors announced receiving first-year funding of $6 million from the Northeast Microelectronics Coalition (NEMC) Hub through U.S. CHIPS and Science Act under the Microelectronics Commons program, executed through the Naval Surface Warfare Center Crane Division and the National Security Technology Accelerator (NSTXL).

The award funds collaboration between Sivers Semiconductors and partners Ericsson, Raytheon, MIT, Boston University, and Northeastern University to accelerate domestic prototyping and expand the nation's global leadership in microelectronics. This is one of six projects awarded to the NEMC Hub, led by Massachusetts Technology Collaborative (MassTech), under the Microelectronics Commons Program.

Sivers Semiconductors will lead the 5G/6G Technology Program, focusing on beamformer IC and array design for FR3 frequencies (7-15 GHz) to enhance future 5G and 6G networks. The program's end applications include enhanced mobile communication, support for IoT devices, and advancements in autonomous vehicle technologies, and is potentially renewable across three years.

FR3 frequencies (7-15GHz) are the next frontier for 5G-Advanced and 6G network deployments. These frequencies combine the best features of sub-6GHz and millimeter-wave bands. They enable significantly wider bandwidths than sub-6GHz frequencies, thus allowing for the significantly higher data rates demanded by emerging wireless applications. At the same time, they exhibit superior propagation characteristics than millimeter-waves, particularly in dense urban environments. This will enable carriers to deploy FR3 infrastructure on existing cell sites without needing to densify the network.

"This initiative propels Sivers into the forefront of 5G/6G innovation," said Vickram Vathulya, CEO of Sivers Semiconductors. "Our collaboration with partners such as Ericsson and Raytheon will allow us to develop relevant innovative technology and products with dual-use applications across commercial and defense sectors."

"We are excited to be part of the first tranche of the Microelectronic Commons projects," said Mathias Riback, Head of Ericsson Advanced Technology & Industry U.S. "By leveraging our expertise in telecommunications and semiconductor technology, we aim to be leading the development of 6G infrastructure. This project also reinforces our commitment to bolstering the U.S. technology ecosystem."