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SAN JOSE, Calif., April 01, 2025--(BUSINESS WIRE)--Lumentum Holdings Inc. ("Lumentum"), a global leader in optical and photonic solutions for the cloud and networking markets, announced today new advancements in foundational indium phosphide (InP) photonic chip technologies designed to deliver higher bandwidth and more power efficient connectivity for next-generation AI-driven data centers. Lumentum’s latest InP innovations — enabling future 400 Gbps-per-lane optical links, more efficient 200 Gbps-per-lane optical links, and co-packaged optics — will be showcased in live demonstrations and a technical presentation at the 2025 Optical Fiber Communications Conference and Exhibition (OFC) at Lumentum booth #2119 in San Francisco, California, April 1-3.
As AI workloads grow exponentially, optical link speeds in AI back-end networks are doubling approximately every two years — driving a critical need for innovation in leading-edge photonic technologies. At the same time, power availability and cooling requirements are placing increasing constraints on data centers, making energy efficiency more important than ever. Lumentum’s InP component technologies directly address both challenges by enabling power-efficient bandwidth scaling in photonic interconnects.
"Building on decades of InP expertise, Lumentum is driving industry technology leadership and volume production readiness for the future 400G per lane generation of optical interconnects, along with more efficient 200G per lane optical interconnects, to enable data center compute capacity scaling," said Matt Sysak, Lumentum CTO of Cloud and Networking. "Lumentum InP technology is also enabling new co-packaged optics solutions to significantly reduce power consumption in AI data center networks, supporting larger AI installations and accelerating the transition from copper to photonic interconnects."
Advancing 400 Gbps-per-Lane Laser Technology
Lumentum is demonstrating 400 Gbps-per-lane photonic technologies poised to enable the 3.2T generation of optical transceivers at OFC 2025 in live demonstrations and partner announcements, including:
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448G EML: Lumentum will demonstrate 448 Gbps data transmission using a 224 GBaud PAM4 externally modulated laser (EML) technology in collaboration with Keysight Technologies and NTT Innovative Devices at booth #1301. Lumentum’s high-bandwidth InP EML will enable next generation power-efficient, high-speed optical interconnects for AI and cloud infrastructure.
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450G PAM4 DFB-MZI: A live demonstration of Lumentum’s 450 Gbps PAM4 distributed feedback (DFB) laser with an integrated Mach-Zehnder (MZI) modulator will highlight another of Lumentum’s 400 Gbps-per-lane technologies. Also based on Lumentum’s high-speed InP photonic technology platform, the DFB-MZI provides superior chirp control, power efficiency, and reduced signal distortion, which are critical advantages for longer reach applications and complements Lumentum’s 400 Gbps-per-lane EML technology. See the demonstration at booth #2119.