Unlock stock picks and a broker-level newsfeed that powers Wall Street.

LONGi unveils Hi-MO X10 module featuring HPBC 2.0 cell technology at Rolex Shanghai Masters

In This Article:

SHANGHAI, Oct. 15, 2024 /PRNewswire/ -- LONGi has officially launched its new generation distributed module product Hi-MO X10 at the Rolex Shanghai Masters. The module, featuring HPBC 2.0 cell technology, marks a milestone upgrade and technological leap for LONGi's BC products.

(PRNewsfoto/LONGi)
(PRNewsfoto/LONGi)

Hi-MO X10 module is designed for the global distributed market, featuring unparalleled safety, enhanced energy output and exceptional aesthetic quality. In addition to HPBC 2.0 cell technology, it also utilizes TaiRay silicon wafers, achieving a maximum mass production power of 670W, which surpasses mainstream TOPCon modules by over 30W, and a maximum module efficiency of 24.8%. This represents the last generation of crystalline silicon cells to achieve an absolute efficiency leap of 1%, signalling the true arrival of the BC era.

Breaking New Ground: HPBC 2.0 + TaiRay Wafer + 0BB Technology

LONGi's HPBC 2.0 cell technology represents a culmination of advancements in BC technology. In November 2022, the company launched HPBC 1.0, ushering in the BC era and now, two years later, HPBC 2.0 retains the excellent genes of its predecessor, achieving breakthroughs in key areas including cell substrates, passivation technology and manufacturing process technology, with mass production cell efficiency exceeding 26.6%, reflecting an absolute efficiency leap of 1.5% within 2 years and establishing a generational gap with other market cells.

Meanwhile, LONGi has broken through other cell technology barriers, its self-developed Bipolar Hybrid Passivation technology allowing the mass-produced cell open-circuit voltage to exceed 745 mV, leading the industry's mainstream TOPCon products by 15mV, significantly reducing current loss and improving cell conversion efficiency.

(PRNewsfoto/LONGi)
(PRNewsfoto/LONGi)

Hi-MO X10 incorporates the company's high-quality N-type TaiRay silicon wafers which had achieved substantial breakthroughs over the past decade. TaiRay silicon wafers offer three major advantages: Firstly, high product concentration results in more concentrated high-efficiency cell grading after cell manufacturing. Secondly, the adoption of new processes reduces oxygen content and other impurities, with fewer single-crystal growth defects, enhancing cell efficiency. Thirdly, the wafers have improved breakage resistance, with a 16% increase in bending strength compared to conventional products.

In order to minimize power loss and boost energy generation, Hi-MO X10 features an HPBC 2.0 cell that adopts an innovative 0BB structure, making it completely free of grid lines on the front and busbars on the back. This allows module power to increase by some 5W (taking the 2382×1134mm module size as an example). It also enhances the aesthetic appeal of the cells' back side and improves bifaciality, unlocking greater potential for future double-sided cell and module innovations.