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LG Innotek Collaborates with World-leading Partner to Drive its Digital Twin Technology

In This Article:

  • Preliminary verification of designs using virtual simulation, reducing development time by 99%

  • Increasing deployment of 'Digital Twin' technology to FC-BGA and electronic component production processes, maximizing manufacturing competitiveness

  • "LG Innotek to become a 'meta-manufacturing' company by advancing Digital Twin technology"

SEOUL, South Korea, Aug. 22, 2024 /PRNewswire/ -- LG Innotek is accelerating its digital transformation to enhance business competitiveness.

(PRNewsfoto/LG Innotek)
(PRNewsfoto/LG Innotek)

On the August 22, LG Innotek (CEO Moon, Hyuksoo) announced that it will partner with Ansys, the world's top engineering simulation company, to expand the application of 'Digital Twin' technology to all its processes.

'Digital Twin' is a technology that replicates objects in a virtual space to predict the outcomes of possible real-life situations through computer simulations. It is heralded as a technology capable of solving various industrial and social problems. In particular, it is being rapidly deployed in the manufacturing industry as it can reduce product development time and costs.

Ansys is known to possess world-leading technology and deployment experience in the field of simulation using 3D modeling, Artificial Intelligence (AI), and Machine Learning (ML). By collaborating with Ansys, LG Innotek will be able to leverage its latest 'Digital Twin' solutions and simulation software to build a state-of-the-art 'Digital Twin' environment.

In collaboration with Ansys, LG Innotek conducted a trial application of its 'Digital Twin' technology to some development and production processes and has achieved tangible results. In the future, the company plans to expand the application of 'Digital Twin' to the development and production processes of its entire product range, including autonomous driving components such as vehicle connectivity and sensing devices.

  • Preliminary verification of designs using virtual simulation, reducing development time by 99%

LG Innotek is reaping the benefits of its 'Digital Twin' in R&D. After verifying designs in a virtual environment, the company uses the data to minimize the number of tests that need to be conducted and the time it takes to conduct them.

It applied 'Digital Twin' technology to the development of package substrate (PS) products for semiconductors, managing to reduce the development time by 99%.

Substrates require the minimization of 'Warpage' due to the heat and pressure to which they are exposed during manufacturing. This is achieved through a simulation process that optimizes the combination of the circuit design structure and materials composition ratio. Using virtual simulation through 3D modeling, LG Innotek has reduced the time required to predict the degree of 'Warpage' of a single substrate from 11 days to 3.6 hours.