InspireSemi Provides Business Update

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Inspire Semiconductor Holdings Inc.
Inspire Semiconductor Holdings Inc.

VANCOUVER, British Columbia and AUSTIN, Texas, June 19, 2024 (GLOBE NEWSWIRE) -- Inspire Semiconductor Holdings Inc. (TSXV: INSP) (“InspireSemi” or the “Company”), a chip design company that provides revolutionary high-performance, energy-efficient accelerated computing solutions for High Performance Computing (HPC), AI, graph analytics, and other compute-intensive workloads, is pleased to announce that today it is providing a general business update by live webinar. Details of the webinar can be found in the Company’s press release dated June 10, 2024.

Key topics the business update covers include:

  • Tapeout of the Company’s Thunderbird I Accelerated Computing SOC (System on Chip) for fabrication at Taiwan Semiconductor Manufacturing Corporation (“TSMC”). See additional press release dated June 19, 2024 for further details.

  • Discussion of the advantages, applicability, and positioning of Thunderbird I:

    • Versatile all-CPU “supercomputer-cluster-on-a-chip” architecture is better fit for real world HPC (High Performance Computing) and graph analytics software applications than datacenter GPUs

    • Best-in-class energy efficiency and affordability

    • Low latency network fabric connects all cores on chip and scales to 256 chips

    • Leverages the established and open RISC-V CPU software ecosystem

  • Market feedback and continued customer traction:

    • HPC & AI industry leaders reiterating need for system like this at major worldwide industry events

    • Expansion into the CAE (Computer Aided Engineering) and cybersecurity industries

  • The Company will discuss its intention to embark upon an uplist to a major U.S. stock exchange (the “Uplist”) and the execution of a non-binding Letter of Intent (the “LOI”) for potential future funding following the Uplist, and anticipated capital needs in the near and long-term in general. Topics include:

    • The Company beginning the process of listing on a major U.S. stock exchange (such as NASDAQ).

    • Execution of LOI dated June 17, 2024 with Fulton Street Capital LLC, a 10X Capital affiliated company, for available future funding following the Uplist via Committed Equity Financing Agreement (the “Uplist Financing”):

      • The Uplist Financing is intended to provide a drawdown facility of up to $100 million in future funding, based upon certain draw mechanics necessary to initiate draws, with such draws solely at the Company’s discretion

      • Certain binding terms under the LOI, including:

        • Confidentiality

        • Exclusivity for the investor to conduct any similar type of financing concurrent with the listing of the Company on a U.S. stock exchange for twenty-four months following execution of the LOI

        • Right of First Refusal to provide not less than 50% of the economic rights of any advisory, agency or brokerage services upon any M&A transaction, or financing undertaken concurrent with the listing of the Company on a U.S. stock exchange for forty-eight months following execution of the LOI

      • The parties plan to progress to Definitive Agreement negotiations

    • The Company discusses near and longer-term funding needs:

      • Intent to launch direct equity Private Placement to help near-term funding to execute on plan while the Thunderbird I chip is at fabrication, to fund costs associated with potential uplist to a major United States exchange, and for general G&A.

      • Longer-term funding needs discussion, including the LOI already mentioned