Unlock stock picks and a broker-level newsfeed that powers Wall Street.
Hyve Solutions Unveils Comprehensive AI Infrastructure Portfolio at NVIDIA GTC 2025

In This Article:

Empowering Scalable AI Deployments for Datacenter, Hybrid Cloud, and Edge Environments

FREMONT, Calif., March 18, 2025--(BUSINESS WIRE)--Hyve Solutions Corporation, a wholly owned subsidiary of TD SYNNEX Corporation (NYSE: SNX) and a leading provider of hyperscale digital infrastructures, today announced its participation at GTC 2025, taking place March 17-21 in San Jose, California. Hyve will showcase its latest AI infrastructure portfolio, designed to support scalable AI deployments across datacenter, hybrid cloud, and edge environments.

End-to-End AI Lifecycle Solutions

Hyve Solutions, an Elite OEM Partner in the NVIDIA Partner Network (NPN) will demonstrate its robust suite of AI solutions, emphasizing key capabilities that address the full AI lifecycle:

  • AI Design & Manufacturing – As a U.S. based fully vertically integrated company, Hyve delivers customized solutions specifically engineered for AI, machine learning (ML), and deep learning (DL) workloads. With in-region manufacturing, including U.S. surface-mount technology (SMT) lines, Hyve ensures high-quality production tailored to meet the performance demands of next-generation AI infrastructure.

  • Scalable Architecture – Hyve’s standardized architecture enables smooth GPU communication across servers and clusters, allowing customers to expand their AI infrastructure without major architectural changes. This design supports quick growth while ensuring operational efficiency.

  • Advanced Testing & Cooling – Hyve is bringing up liquid cooled pods in its Olive Branch, MS, facility in Summer of 2025, offering extensive testing for NVIDIA GPUs. Custom testing solutions can be requested, ensuring optimal performance and reliability for high-density AI deployments.

  • Global Deployment Capabilities – Hyve Leverages an extensive global footprint and deep regional compliance expertise to enable rapid AI datacenter deployment across all major geographies, supporting enterprises in accelerating AI initiatives worldwide.

Showcasing Industry-Leading AI Solutions

Conor Malone, VP of Engineering at Hyve Solutions, will speak during the conference on March 18, starting at 3:20 p.m. PT in the SJCC Hall 3 Theater. His topic will be Building the Next-Gen AI Data Center: From Design to Deployment at Scale. Malone will delve into the convergence of accelerated computing, networking, and cooling technologies that enable modern AI factories.

He will discuss the requirements for delivering scalable AI solutions, highlighting the complexities of custom design, global deployment infrastructure, and understanding testing frameworks. Particular attention will be paid to liquid cooling integration, GPU validation, and the challenges of scaling AI factories across different geographies.