Edgewater Wireless Provides Corporate Update

In This Article:

Highlights:

  • Edgewater to aggressively execute three high-impact initiatives in the next 6 months:

    • Advance silicon production - complete RF Front End packaging for its disruptive Wi-Fi Spectrum Slicing™ silicon solution

    • Launch and commercialize breakthrough Industrial Internet of Things (IIoT) Wi-Fi Spectrum Slicing-powered access point solution - delivering a transformative product that redefines connectivity in industrial environments

    • Expand intellectual property portfolio - forging strategic alliances and unlocking new revenue streams to maximize value

  • Silicon Catalyst in-kind partner network providing critical resources and support as we bring our next-generation silicon solutions to production

OTTAWA, Ontario & SILICON VALLEY, Calif., March 25, 2025--(BUSINESS WIRE)--Edgewater Wireless Systems Inc. (TSXV: YFI) (OTC: KPIFF), the industry leader in Wi-Fi Spectrum Slicing technology for residential and enterprise markets, is pleased to provide a corporate update highlighting our recent progress, strategy and plans for the year ahead.

Advancing the Future of Wi-Fi with Spectrum Slicing

Edgewater Wireless continues to drive innovation and redefine the future of Wi-Fi with our patented Wi-Fi Spectrum Slicing technology. Over the past 12 months, we have made significant strategic advancements, including several AI-related patent applications, strengthening our position as the leader in next-generation Wi-Fi innovation. Our vision is clear: to establish Wi-Fi Spectrum Slicing as the global standard, delivering unparalleled performance, efficiency, and scalability for the wireless world.

Industry Recognition & Thought Leadership

Reinforcing our position at the forefront of wireless technology innovation, Edgewater Wireless was selected to speak at the prestigious 2025 CableLabs Winter Conference. Our presentation, "Making Wi-Fi Smarter Through AI-Powered Spectrum Slicing," revealed our initiatives to redefine the economics of Wi-Fi by empowering service providers with the next generation of intelligent edge devices.

Using our patented AI-enabled algorithms, we highlighted the standards-leading capabilities of our next-generation Wi-Fi silicon solutions and discussed the customer-driven feature enhancements of our MLX488 platform. Of particular interest, the presentation offered insights into the benefits of joining the Arm® Flexible Access program as the initiative grants access to cutting-edge Arm IP, allowing us to optimize Spectrum Slicing technology for next-generation Wi-Fi chipsets. By integrating AI-driven intelligence at the edge, we are paving the way for a more intelligent, efficient wireless ecosystem built on a foundation of increased in-band link or channel density.