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For the 9th consecutive year, Dow (NYSE:DOW) has been recognized for innovation by the Business Intelligence Group (BIG). In the 2025 BIG Innovation Awards, Dow technologies won six awards in the Transformative Products category-more than any other company. This matches the record number of BIG Innovation Awards Dow received in 2024.
"Once again receiving six BIG Innovation Awards is a testament to the unwavering commitment and ingenuity of our team," said A. N. Sreeram, senior vice president of R&D and chief technology officer. "These awards not only highlight our dedication to developing transformative products that address the evolving needs of our customers but also reinforce our passion for driving sustainable and impactful innovations."
2025 BIG Innovation Award Winners
The Dow technologies listed below were all awarded in the Transformative Products category.
ACUSOL™ Prime 2 Polymer is a biodegradable dispersant with high bio-based carbon content for automatic dishwashing applications offering excellent shine performance while contributing to more sustainable cleaning.
AXELERON™ FO 6321 BK Telecom Cable Compound is a black, UV-stabilized HDPE cable jacket material designed for mini- and micro- fiber optic applications but useful across all power and telecommunication applications. It allows for more fibers in smaller cables that are easy to identify and trace, allowing for more efficient installations. Its high-performance properties support cables that are tough, weather-resistant, and can be produced quickly.
DALPAD™ A Plus Coalescing Agent is a low SVOC low-odor additive used in aqueous coatings and emulsion polymers to help form a homogeneous, strong coating during the drying process. It enables more sustainable coating solution with > 60% SVOC reduction for significantly improved indoor air quality and less worker exposure during application and ensures that the coating has excellent performance. The product has high efficiency in reducing the minimum film-forming temperature of the emulsion, as well as adapting to lower operating temperatures and reducing the impact of low temperatures on the decoration period. Coatings with DALPAD™ A Plus Coalescing Agent remain viscosity stable even after freeze-thaw or heat storage. And the coating has good low-temperature crack resistance and scrub resistance.
DOWFROST™ LC Heat Transfer Fluid is used for the direct-to-chip cooling of heat generating rack components in data centers. Cooling accounts for up to 40% of the energy demand from data centers, direct-to-chip cooling is an innovative solution offering a more effective option compared to conventional air cooling. DOWFROST™ LC Heat Transfer Fluid provides exceptional heat removal, corrosion protection, and compatibility with various materials, significantly reducing energy consumption. It extends the life of IT equipment, has minimal toxicity, is biodegradable, and has been rigorously tested for long-term reliability.