Credo to Showcase Datacenter AI, Compute and CXL with XConn PCIe and CXL Switches at OCP Global Summit 2024

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Credo to Showcase Datacenter AI, Compute and CXL with XConn PCIe and CXL Switches at OCP Global Summit 2024. Live Demos to Include Newly Introduced PCI Express 6.0 Devices and CXL Interconnect. (Graphic: Business Wire)
Credo to Showcase Datacenter AI, Compute and CXL with XConn PCIe and CXL Switches at OCP Global Summit 2024. Live Demos to Include Newly Introduced PCI Express 6.0 Devices and CXL Interconnect. (Graphic: Business Wire)
Credo will demonstrate Toucan, its newly introduced PCI Express (PCIe) 6.0 retimer, and 1Tb OSFP-XD PCIe6 (16x64Gb) Active Electrical Cable (AEC). In addition, Credo will display its 800G sub-10W OSFP optical modules with Linear Receive Optics (LRO) capability interoperating with 51T switches and standard DSP modules. In the OCP Innovation Village, Credo is working with AMD, GIGABYTE, MemVerge, MSI, Penguin Solutions, Rittal, SMART Modular Technologies, and XConn to show live demonstrations of PCIe and Compute Express Link (CXL) interconnect. Additionally, the solution providers will showcase how rack power/density increases as liquid cooling technology penetrates the data center.
Credo will demonstrate Toucan, its newly introduced PCI Express (PCIe) 6.0 retimer, and 1Tb OSFP-XD PCIe6 (16x64Gb) Active Electrical Cable (AEC). In addition, Credo will display its 800G sub-10W OSFP optical modules with Linear Receive Optics (LRO) capability interoperating with 51T switches and standard DSP modules. In the OCP Innovation Village, Credo is working with AMD, GIGABYTE, MemVerge, MSI, Penguin Solutions, Rittal, SMART Modular Technologies, and XConn to show live demonstrations of PCIe and Compute Express Link (CXL) interconnect. Additionally, the solution providers will showcase how rack power/density increases as liquid cooling technology penetrates the data center.

Live Demos to Include Newly Introduced PCI Express 6.0 Devices and CXL Interconnect

SAN JOSE, Calif., October 14, 2024--(BUSINESS WIRE)--Credo Technology Group Holding Ltd (Credo) (NASDAQ: CRDO), an innovator in providing secure, high-speed connectivity solutions that deliver energy efficiency as data rates and corresponding bandwidth requirements increase throughout the data infrastructure market, is excited to announce its participation in the upcoming OCP Global Summit from October 15-17, 2024, in San Jose, CA. The event will provide Credo with a platform to showcase generative AI, general compute and operator focused connectivity solutions and include multiple presentations by Credo executives.

Conference: OCP Global Summit
Date: October 15-17, 2024
Location: San Jose Convention Center, San Jose, CA
Locations: Booth B31 and the OCP Innovation Village

Credo Exhibit Highlights:

Credo will demonstrate Toucan, its newly introduced PCI Express (PCIe) 6.0 retimer, and 1Tb OSFP-XD PCIe6 (16x64Gb) Active Electrical Cable (AEC). In addition, Credo will display its 800G sub-10W OSFP optical modules with Linear Receive Optics (LRO) capability interoperating with 51T switches and standard DSP modules.

In the OCP Innovation Village, Credo is working with AMD, GIGABYTE, MemVerge, MSI, Penguin Solutions, Rittal, SMART Modular Technologies, and XConn to show live demonstrations of PCIe and Compute Express Link (CXL) interconnect. Additionally, the solution providers will showcase how rack power/density increases as liquid cooling technology penetrates the data center.

The first live demonstration of a rack-scale shared H100 GPU will consist of an AMD EPYC server connected to an XConn PCIe 5 switch via Credo OSFP-XD PCIe AECs, with the XConn switch further driving two chassis of NVIDIA H100 GPUs.

In the second live demonstration, a rack-scale CXL2.0 shared memory system will be demonstrated with Memory Machine X software from MemVerge showing AMD EPYC 9005 servers connected to an XConn CXL switch via Credo CXL AECs, the XConn CXL Switch connecting to two chassis full of CXL memory – one based on CEM AIC form factor from SMART Modular – one based on the E3 form factor from Micron. This will enable the servers to fully access and share the CXL memory using the CXL.mem protocol.

In the third showcase, a series of three AI GPU racks will illustrate the impact of liquid cooling on racking and network configurations. A 10kW air cooled rack, a 50kW air cooled rack, and a 120kW liquid cooled rack, all based on the Open Rack v3 (ORv3) standard with the Rittal liquid cooling plenum attached, and a full set of networking interconnect based on Credo’s AECs and optical devices, will be connected to support the front-end, scaleout and scaleup Networks necessary for these advanced racks.