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Aehr Announces Shipment of Initial FOX-XP Wafer-Level Burn-In System for Advanced AI Processors

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FREMONT, CA / ACCESS Newswire / February 28, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has completed shipment of its first FOX-XP™ wafer level burn-in system for an artificial intelligence (AI) customer, delivering its high-power FOX-XP system and multiple proprietary WaferPakTM Contactors for production wafer level test and burn-in of advanced AI processors.

Gayn Erickson, President and CEO of Aehr Test Systems, commented, "We are pleased to have collaborated with the customer on completing initial wafer production testing and to have shipped within Aehr's fiscal third quarter as planned the initial volume production solution that is testing nine wafers in parallel on our new high-power FOX-XP system.

"Delivering the industry's first wafer level burn-in solution for the AI processor market marks a major milestone for Aehr, opening a significant new market opportunity for our FOX-XP wafer level test and burn-in systems. Our high-power FOX-XP multi-wafer system and proprietary WaferPak Contactor offer a scalable, cost-effective manufacturing solution for testing and burn-in of AI processors at wafer level, eliminating the need for more expensive system-level burn-in.

"This latest turnkey solution, featuring the FOX-XP multi-wafer test and burn-in system with proprietary WaferPak full wafer Contactors, delivers thousands of watts of power and precise thermal control per wafer while testing and monitoring the device functionality. This breakthrough technology enables cost-effective production test and burn-in of high-power devices such as AI accelerators at wafer level temperatures of up to 150 degrees Celsius. By identifying and eliminating early life failures during wafer level production, we help customers reduce manufacturing costs and improve overall yield.

"With this solution, we now offer customers the flexibility of production wafer level burn-in for their AI processors and accelerators, complementing our Sonoma ultra-high-power system for package part burn in, which we are shipping in volume to many manufacturers worldwide. Aehr Test Systems is the only company in the world that provides both wafer level and package level turnkey test and burn-in solutions for the AI processor market."

The FOX-XP and FOX-NP systems, available with multiple WaferPak Contactors (full wafer test) or multiple DiePakTM Carriers (singulated die/module test) configurations, are capable of functional test and burn-in/cycling of devices such as artificial intelligence processors and accelerators, silicon carbide and gallium nitride power semiconductors, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.