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ACMR is Trading Dirt Cheap: Is it an Opportunity for Investment?

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ACM Research ACMR shares are cheap, as suggested by a Value Score of B.

In terms of the forward 12-month Price/Sales ratio, ACM Research is trading at 1.4, lower than the sector’s 5.49. 

ACMR is cheap compared to its peers, including Applied Materials AMAT, Lam Research LRCX and Tokyo Electron TOELY, which are currently trading at forward 12-month Price/Sales of 4X, 5.19X and 3.96X, respectively.

Price/Sales (F12M)

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ACMR Outperforms Industry, Peers

ACMR shares have rallied 54.6% in the year-to-date period, outperforming the Zacks Computer & Technology sector’s decline of 11.7% and the Zacks Semiconductor Equipment - Material Services industry’s return of 32.5%

ACMR shares have outperformed its peers, including Applied Materials, Lam Research and Tokyo Electron. These companies remain key competitors in the semiconductor equipment industry, particularly in wafer cleaning, deposition, and other critical fabrication processes.

While LRCX shares have risen 0.7%, AMAT and TOELY shares have plunged 10.7% and 9.3%, respectively, in the year-to-date period.

The outperformance can be attributed to ACMR’s expanding market presence, particularly in China and globally, driven by a robust portfolio and increased customer base.

YTD Performance

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Hence, investors should ask this question: Can ACMR maintain its growth momentum with its expanding product portfolio and customer base?

ACMR Expands Product Portfolio With New Semiconductor Tools

ACMR has diversified its product offerings across cleaning, plating, and advanced packaging, with new products, such as Tahoe, Sulfuric Peroxide Mixture (SPM) and track and furnace tools contributing to its growth. These products target a substantial global semiconductor market, with ACMR estimating its Serviceable Available Market to be approximately $18 billion.

Building on this momentum, the company announced in March 2025 that a major logic device manufacturer in mainland China has qualified its Single-Wafer High-Temperature SPM tool. 

The tool, designed for advanced semiconductor and packaging applications, features ACM’s proprietary nozzle design for superior particle control and reduced maintenance, supporting wet etching and wafer cleaning for technology nodes at 28nm and below.

Further expanding its portfolio in December 2024, ACMR announced the qualification of its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition Furnace tool for mass production at a mainland China semiconductor customer, alongside the successful process qualification of its Ultra Fn A Thermal Atomic Layer Deposition (Thermal ALD) Furnace tool with another leading mainland China customer.