Taiwan Semiconductor to Invest $100 Billion in U.S. Chip Plants
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Taiwan Semiconductor Manufacturing plans to invest $100 billion to build out chip-making facilities in the U.S., according to people familiar with the matter. The company intends to make the investment over the next four years as part of a federal effort that could be announced as soon as later today, The Wall Street Journal first reported. In an email to Barron’s, TSMC confirmed that CEO C.C. Wei would appear at the White House on Monday.
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