- Previous Close
3,640.00 - Open
3,640.00 - Bid 3,650.00 x --
- Ask 3,660.00 x --
- Day's Range
3,635.00 - 3,675.00 - 52 Week Range
3,000.00 - 9,630.00 - Volume
22,393 - Avg. Volume
308,631 - Market Cap (intraday)
159.814B - Beta (5Y Monthly) 1.13
- PE Ratio (TTM)
-- - EPS (TTM)
-- - Earnings Date Feb 21, 2025 - Feb 25, 2025
- Forward Dividend & Yield --
- Ex-Dividend Date Dec 29, 2021
- 1y Target Est
8,000.00
LB Semicon Inc. provides flip-chip wafer bumping technology solutions in South Korea. It offers wafer-level packaging technology for packaging and testing integrated circuits; gold bumped wafers, which are applied on various packages, such as chip on glass, chip on film, and chip on plastic; solder bumps for various flip chip packages; Cu pillar bumps; Au RDL, which is used to reposition the layout of the I/O pad; and thick Cu products. The company also provides chip probe test; and back-end services, such as laminating, back grinding, laser marking and grooving, SAW, plasma, post AVI, UV irradiation, pick and place, AVI, visual inspection and packing services, as well as back side coating, foil mount, and tape and reel. LB Semicon Inc. was founded in 2000 and is based in Pyeongtaek-Si, South Korea.
www.lbsemicon.comRecent News: 061970.KQ
View MorePerformance Overview: 061970.KQ
Trailing total returns as of 12/24/2024, which may include dividends or other distributions. Benchmark is .
YTD Return
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5-Year Return
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Statistics: 061970.KQ
View MoreValuation Measures
Market Cap
159.38B
Enterprise Value
454.42B
Trailing P/E
--
Forward P/E
--
PEG Ratio (5yr expected)
--
Price/Sales (ttm)
0.35
Price/Book (mrq)
0.66
Enterprise Value/Revenue
0.99
Enterprise Value/EBITDA
5.12
Financial Highlights
Profitability and Income Statement
Profit Margin
-2.48%
Return on Assets (ttm)
-1.13%
Return on Equity (ttm)
-3.60%
Revenue (ttm)
444.89B
Net Income Avi to Common (ttm)
-11.06B
Diluted EPS (ttm)
--
Balance Sheet and Cash Flow
Total Cash (mrq)
39.59B
Total Debt/Equity (mrq)
96.70%
Levered Free Cash Flow (ttm)
-70.73B