(Bloomberg) -- Huawei Technologies Co. is seeking to raise a $1.5 billion-equivalent loan, shortly after sealing a similar-sized financing in July, according to people familiar with the matter.

The Chinese smartphone maker is in talks with international and Chinese lenders for the facility, with Huawei Investment & Holding Co. providing a letter of comfort, said the people who are not authorized to speak publicly and asked not to be identified. Funds raised will be used for general corporate purposes and working capital, they said. Huawei declined to comment when contacted by Bloomberg.

The provider of networking gear has been at the center of China’s conflict with the U.S. over trade and key technologies. Yet it has been able to line up funding in the loan market with $3.5 billion raised in less than a year, data compiled by Bloomberg show.

In July, Huawei raised HK$11.7 billion ($1.49 billion) from five Chinese banks, which marked its first offshore funding in the loan market without the help of international banks. The Shenzhen-based company has also signed a 14 billion yuan onshore loan in December 2018.

The latest round of financing, denominated in Hong Kong dollars, U.S. dollars or Euros, will be borrowed via Huawei Technologies Cooperatief Ua, said the people.

--With assistance from Gao Yuan.

To contact the reporters on this story: Annie Lee in Hong Kong at olee42@bloomberg.net;Carol Zhong in Hong Kong at yzhong71@bloomberg.net

To contact the editors responsible for this story: Richard Frost at rfrost4@bloomberg.net, ;Fion Li at fli59@bloomberg.net, Chan Tien Hin, Finbarr Flynn

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